
Qualcomm Buries Chips Under DRAM to Break the AI Memory Wall
Qualcomm has unveiled its High-Bandwidth Compute (HBC) architecture, which stacks DRAM directly on top of AI accelerators to shorten distances and multiply effective bandwidth. The company promises 133 TB/s effective in its AI250, 18 times more than the previous generation, though the figures have raised doubts in the industry.
